The ucd3138 bridgeless PFC chip is a Texas Instruments digital power controller featuring:

Everyone should know that the screening of electronic components is very necessary, so today we will analyze the selection principles of electronic components screening items and stress conditions, and introduce several commonly used screening items and typical semiconductor screening scheme design. Let‘s have a look!

With the development of integrated circuits, there are dozens of types of packaging, not all of which are used by us. From the structure, it can be seen that the development of packaging: TO->DIP->SOP->QFP->PLCC->BGA->CSP .

Since the invention of electronic devices, they have been favored by major scientific and technological workers. Today, let‘s talk about the future development direction of electronic components.

The DLP230NP chipset consists of a 0.23-inch 1080p DLP230NP DMD and a dedicated DLPC3436 display controller. The chipset can also choose to use one of the DLPA2000, DLPA2005 or DLPA3000 as a power management chip and LED lighting driver, depending on the required brightness and power.

Xilinx has larger capacity FPGA chips. Alibaba Dharma Academy also published FPGA chip technology for AI voice. So is there anything special about FPGA chips? What does the hot 5G have to do with the AI ​​field?

electronic components ordering must provide professional, high-efficiency, one-to-one electronic component ordering services to solve the most fundamental needs of customers, reduce production costs, and improve effectiveness.

Brick power supply means that the power module is also called brick power supply because of its small size and high power, and its shape after modular packaging is like a brick. It is one of the power modules.