Infineon offers the AIROC CYW20835 module, which provides a complete system solution for Bluetooth Low Energy connectivity.

The fully integrated CYBLE-343072-02, CYBLE-333073-02 and CYBLE-333074-02 modules include a crystal oscillator, passives and flash memory, and a Bluetooth low energy radio system-on-chip (SoC) AIROC CYW20835. The modules are packaged in a 13.31 mm x 21.89 mm x 1.95 mm package and include a license-free Bluetooth stack that is compliant with the Bluetooth 5.0 specification. These application-ready modules help OEMs save development time and speed time to market.

These modules are supported by the AIROC Bluetooth software development kit from the ModusToolbox software suite, which includes code examples for embedded Bluetooth Low Energy applications. Infineon certifies these modules to comply with global RF regulations, saving developers cost and time in product development.

The AIROC module is based on the CYW20835 Bluetooth Low Energy SoC compliant with the Bluetooth 5.2 core specification. The SoC features an integrated microcontroller based on a 96 MHz Arm Cortex-M4 processor core that runs the Bluetooth stack and applications. The SoC‘s Bluetooth radio is energy efficient, consuming only 8 mA in receive mode and 18 mA when transmitting at a maximum output power of 12 dBm.

Components supported by the evaluation board for the Bluetooth module: CYW920835M2EVB-01

ModusToolbox 2.3 and Bluetooth SDK 3.0 or later support the CYW20835 device and the CYW920835M2EVB-01 evaluation kit. The kit‘s hardware includes:

1. Ambient light sensor, thermistor, pad of analog microphone and pad of Infineon digital microphone;

2. User switch and LED;

3. USB connector for power, programming and USB-UART bridge.

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