Manufacturer:Xilinx Inc.
Architecture:MCU, FPGA
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature:-40°C ~ 100°C (TJ)
Package Case:1760-BBGA, FCBGA
Peripherals:DMA, WDT
Primary Attributes:Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Series:Zynq® UltraScale+™ MPSoC EG
Speed:533MHz, 600MHz, 1.3GHz
Supplier Device Package:1760-FCBGA (42.5x42.5)