The detection of components is an essential basic work. How to accurately and effectively detect the relevant parameters of components and judge whether the components are normal is not a cookie-cutter thing, and different methods must be used according to different components. , so as to judge whether the components are normal or not.

There are three main types of testing items for electronic components:

1. Routine test

Mainly test the appearance, size, electrical performance, safety performance, etc. of electronic components;

Test the basic parameters according to the specifications of the components, such as triodes, to test the appearance, size, ICBO, VCEO, VCES, HFE, pin tension, pin bending, solderability, soldering heat resistance and other items, and some export products also need to be tested. Test RoHS.

2. Reliability test

Mainly test the life of electronic components and environmental tests;

According to the requirements of the user and the requirements of the specification, the life of the device and various environmental tests, such as triodes, should be tested for high temperature test, low temperature test, tide state test, vibration test, maximum load test, high temperature durability test and other items. ;

3. DPA analysis

It mainly controls the internal structure and process of the device.

Such as triode, the main means are X-ray detection of internal structure, sound scan to monitor the internal structure and packaging process, unsealing to monitor the internal wafer structure and size, etc. Among them, X-Ray real-time imaging technology is widely used, and is favored by more and more electronic product manufacturers because of its non-destructive, fast, easy-to-use, and relatively low-cost characteristics. X-ray inspection can be used to check the internal state of components, such as chip layout, lead layout and lead frame design, solder balls (leads), etc. For components with complex structures, the angle, voltage, current, and image contrast and brightness of the X-ray tube can be adjusted to obtain effective image information.

The above are the three tests that electronic components generally need to do, I hope to help everyone.