One，ADI chip usage

At present, the main mobile phone chip platforms include MTK, ADI, TI, AGERE, ST-NXP Wireless, INFINEON, SKYWORKS, SPREADTRUM, Qualcomm, etc. The domestic GSM series mobile phones can be divided into eight platforms: MTK, ADI, TI, AGERE, PHILIPS, INFINEON, SKYWORKS, and SPREADTRUM.

 

With the popularization of smart phones, mobile phone chips are required to support various multimedia functions, such as video downloading, online entertainment, data sharing, and video calling. Mobile multimedia chips are chips that support multimedia functions such as GPS, image processing, mobile TV, audio processing, video processing, and FM.

 

The ADI analog-to-digital converter driver uses the VOCM pin to achieve precision and high-speed differential amplifiers, providing links and convenient handling plans for continuous analog-to-digital converters (ADC). The sampling circuit input through the ADC quickly eliminates a large amount of disturbing energy sent to the output of the amplifier, thereby realizing the link function of any ADC driver. ADI has developed a wide range of high-speed differential amplifier products. Whether you need to drive a single differential or double differential input ADC, or send and receive signals through a long cable, the responsive products provide high-performance products that meet any requirement. Differential input and output can also improve the system by reducing the total harmonic distortion received by the ADC.

 

ADI chip products provide: amplifiers, linear products, data converters, audio and video products, broadband products, clocks and on-time ICs, optical fiber and optical fiber communication products, interfaces and disconnects, MEMS and sensors, power and thermal management, processor and DSP , RF and graphic processors, switches and splitters, etc.

 

Second, the naming rules of ADI chips

IC naming rules are the basic knowledge of IC that every chip decryption practitioner should understand and master. A complete IC model generally must contain at least the following four parts:

1. Prefix (header)-----many products can be guessed from which company;

2. Device name----Generally, the function of the product can be inferred (memory can know its capacity);

3. Temperature grade-----to distinguish commercial grade, industrial grade, military grade, etc.;

4. Package ---- Indicate the package and pin number of the product.

 

Some IC models will have other content:

Speed-----such as memory, MCU, DSP, FPGA and other products have different speeds, such as -5, -6 and other digital representations;

Process structure ---- For example, there are two kinds of general digital ICs, COMS and TTL, which are usually represented by the letters C and T;

Whether it is environmentally friendly-----Generally, there will be a letter at the end of the model to indicate whether it is environmentally friendly, such as Z, R, +, etc.;

Packing-----show the kind of packing the material is transported, such as tube, T/R, rail, tray, etc.;

Version number ---- displays the number of times the product has been modified, generally with M as the status of the first version of the product.

 

Example: (1) EP 2C70 A F324 C 7 ES:

EP-altera‘s products;

2C70-CYCLONE2 series FPGA;

A-Specific electrical performance;

F324-324pin FBGA package;

C-civilian products;

7-rate level;

ES-engineering samples.

 

(2) MAX 232 A C P E +:

MAX-maxim company products;

232-interface IC;

A-A file;

C-civilian grade;

P-plastic two-row in-line;

E-16 feet;

+ Indicates a lead-free product.