The
xilinx-7 series of FPGAs mainly include: Spartan®-7, Artix®-7, Kintex®-7, Virtex®-7. Its performance, density, and price also increase with the series. Different from previous generations of FPGA products, the 7 series FPGA adopts a unified 28nm design architecture, and customers use the different sub-series in a unified way, eliminating the inconvenience caused by switching between different sub-series. Of course, the Kintex®-7 and Virtex®-7 series are followed by 20nm and 16nm design architectures.
1. Spartan7 series
In the xilinx-7 series, its price is the lowest, the actual power consumption is the lowest, and it has the smallest package size. Of course, its design difficulty is the lowest, which is very suitable in some low-end application scenarios.
1. 30% faster than the 45nm device family;
2. Up to 1.25Gb/s LVDS;
3. Highly flexible soft memory controller supports every second;
4. 25.6Gb peak DDR3-800 memory bandwidth;
5. XADC and SYSMON for integrating discrete analog and monitoring circuits;
6. Cost optimization for system I/O expansion;
2. Artix7 series
In the xilinx-7 series, compared with the Spartan7 series, the DSP function and serial transceiver are added. Of course, its logic capacity is also larger, and it is widely used in some low-end and middle-end applications with slightly more complex logic.
1. Featuring low power consumption and low cost, it is 30% faster than Spartan-6, consumes half less power, and reduces price by 35%;
2. The use of FPGAs based on the Virtex series architecture can meet the performance requirements of cost-sensitive, high-volume markets;
3. Use built-in Gen1x4 PCI Express® technology to achieve 3.75Gpbs serial connection function;
4. Wire-bonded chip-level BGA package realizes miniaturization and low cost;
5. It can meet the low power consumption and high performance requirements of battery-powered portable ultrasonic equipment;
6. It can meet the small and low power consumption requirements of commercial digital camera lens control;
7. Can meet the strict SWAP-C (size, weight, power consumption and cost) requirements of military avionics and communication equipment;
8. Size, weight and power consumption characteristics are particularly suitable for handheld applications such as portable ultrasound, digital camera control and software-defined radios;
3. Kintex7 series
In the xilinx-7 series, it can be said that it has the best price/performance ratio. Whether it is the logic capacity or the number of hard cores, it can meet the needs of low-end and even some high-end applications.
1. The industry‘s highest system performance and capacity, with a density of 2 million logic cells, 2.5 times higher than all previous and existing FPGAs;
2. Compared with Virtex-6, the system performance of Virtex-7 is doubled, the power consumption is reduced by half, and the speed is increased by 30%. It is the highest-end sub-series in the 7 series;
3. Provides high-performance 10.3Gbps or low-cost optimized 6.5Gbps serial connectivity, memory and logic performance required for various applications such as high-volume 10G optical wired communications equipment;
4. It achieves the best balance of signal processing performance, power consumption and cost, can support long-term evolution (LTE) wireless network deployment, and meet the strict power consumption and cost requirements of the new generation of high-definition 3D flat-panel displays;
5. Provide the performance and bandwidth required for a new generation of broadcast video-on-demand systems;
6. 10.3125Gbps serial connection function and built-in Gen2x8 PCI Express technology;
7. Rich block memory and DSP resources, ideal for wireless LTE infrastructure equipment, LED backlight and 3D digital video displays, medical imaging and avionics imaging systems;
4. Virtex7 series
In the xilinx-7 series, it is the top existence, it can be said to be the top model, the king of high-end applications, if it is used in low-end applications, it must be overkill!
1. Established a new industry performance benchmark;
2. Compared with Virtex-6 devices, the system performance is doubled, the power consumption is reduced by half, the signal processing capability is increased by 1.8 times, the I/O bandwidth is increased by 1.6 times, and the memory bandwidth is increased by 2 times;
3. It is the FPGA with the highest density in the industry, with up to 2 million logic cells achieving a breakthrough capacity;
4. Using EasyPath-7 devices, it can ensure a 35% cost reduction without any design conversion;
5. Support 400G bridging and switching structure wired communication system, which is the core of global wired infrastructure;
6. Support advanced radar systems and high-performance computer systems, which can meet the requirements of single-chip TeraMACC signal processing capabilities and the logic density, performance and I/O bandwidth requirements of a new generation of test and measurement equipment;
7. Implement a new generation of 100GE line cards, 300G bridges, terabit switch fabrics, 100G OTN wavelength converters, radar and ASIC emulation.