With the rapid growth of the semiconductor industry in recent years, some businesses in the component market are driven by their interests, and power management IC refurbishment has become an increasingly common problem. There are many goods and so on. When it comes to the authenticity of the original electronic components, it is nothing more than need to distinguish, so we need some common sense to distinguish these power management chips.
1. Appearance inspection: Incoming packaging status, device production batch number, label, etc. confirmation, device surface condition, Marking standard, important signs, device logo, IC pin condition, body characteristics, PIN1 logo, etc.
2. Decap (decap test): use chemical reagents to corrode the body of the IC, use a high-power microscope to check the condition of the wafer inside the IC, and identify the authenticity of the wafer.
3. Acetone wipe test: identify whether the IC printing is re-marked.
4. Electrical performance test: use the IC test system to test the DC parameters of the pins of the device, including pin open circuit, short circuit, etc., and then analyze the device performance.
5. Device power-on test: add excitation power to the VCC, VDD, GND and other pins of the device, and test the quiescent current, output current, etc.
6. Functional test, key function test (KFT): According to the original PDF specification, the key functions of the device are tested and verified to see if they meet the requirements of the specification. The stimulus applied by the device is completely based on the specification. This test is the most accurate It reflects whether the IC can be used, many old materials (refurbished), and the appearance of the IC is defective. Through this test, you can know whether the device can be used again. Including some basic devices, such as: power management voltage conversion, AD, DA data conversion, amplifier signal amplification and transmission, the quality of memory storage units and so on.
7. Environmental protection test, ROHS test: detection of harmful chemical substances, lead (Pb) mercury (Hg) cadmium (Cd) hexavalent chromium (Cr6+) polybrominated biphenyls (PBB) polybrominated diphenyl ethers (PBDE) and other elements and substances to see if they exceed international standards .
The harm of counterfeit components can be big or small, but it should not be underestimated. These counterfeit power management ICs are mostly general-purpose devices, mainly concentrated in the low-end area. With the continuous growth of counterfeit power management chips and the continuous improvement of counterfeiting technology, this also This poses greater challenges for buyers, and it also means that the electronics industry needs to do more to eliminate the ill effects of counterfeit components.