The so-called power management IC chip packaging is to fix the manufactured wafer, bind the pins, and make various types of chips according to the needs, such as: BGA, DIP, QFP, PLCC, QFN and so on. As for the package to be adopted, it is determined by the application environment, market form, cost control and other factors.

The main packaging types of power chips are as follows:

BGA type packaging: When the frequency of the IC exceeds 100MHZ, or when the number of pins of the IC is greater than 208 Pins, the traditional packaging method has its difficulties. Therefore, most of today‘s high-pin-count chips are converted to BGA packaging technology , shortens the signal transmission path, reduces the lead inductance and resistance; the signal transmission delay is small, and the adaptable frequency is greatly improved, so the performance of the circuit can be improved.

DIP dual in-line package: integrated circuit chips packaged in dual in-line form. Soldering is easy to operate, and it is also the most popular plug-in package. The application range includes standard logic IC, memory and microcomputer circuits.

QFP/PFP type package: The distance between the pins is very small and the pins are very thin. Generally, large-scale or ultra-large integrated circuits use this package form, which is suitable for SMD surface mounting technology to install wiring on PCB circuit boards.

SO type package: including SOP (small outline package), TOSP (thin small outline package), SSOP (shrinked SOP), VSOP (very small outline package), SOIC (small outline integrated circuit package), etc. This type of package A lot of pins are made around the packaged chip, the package operation is convenient, and the reliability is relatively high.

PLCC package type: It is a plastic chip package carrier with leads. It is a surface mount package. The pins are drawn from the four sides of the package, in a T-shaped shape. The overall size is much smaller than that of the DIP package. It is suitable for SMT Surface mount technology installs wiring on PCB, which has the advantages of small size and high reliability.

QFN Package Type: A leadless quad flat pack that is a lead-free package with peripheral termination pads and a die pad exposed for mechanical and thermal integrity, has excellent thermal performance, and is lightweight for portable applications.

The form of packaging basically determines the appearance of the power chip. There are dozens of common power management chip packaging methods. Among the chips seen in daily life, BGA, QFP, SO, and DIP are more common.