Welcome to ShenZhen Hao Qi Core Technology Co., Ltd
NEWS
CONTACT US
Contact Person: Mr. Andy Luo
Job Title: Sales
Business Phone: +(86) 13632701337 (electronic component) , +(86)13632701337 (Automation Part )
WHATSAPP: +86 13632701337 (electronic component) , +(86)13632701337(Automation Part )
Wechat: +86 13632701337 (electronic component) , +(86)13632701337 (Automation Part )
Skype: happylowping
ICQ: 458036258
Email: andyluo@kinglionski.com  (electronic component) , andyluo@kinglionski.com  (Automation Part )
Company NewsYou are here:HOME >> NEWS >> Company News
Attacking chip foundry services, Siemens joins Intel EDA alliance
Publish:IC chip, PCB, PCBA, integrated circuit and other electronic components-Shenzhen Hao Qi Core Technology Co., Ltd  Time:2022-05-29  Views:435
Siemens Digital Industries Software announced that it has joined as a chartered member of the EDA Alliance in the Intel Foundry Services (IFS) Acceleration Program. Intel‘s IFS program aims to create a complete ecosystem based on IFS‘ advanced process technology to provide design and manufacturing support for a new generation of system-on-chip (SoC).
This program fosters collaboration between IFS and its ecosystem partners focused on reducing risk and addressing design barriers to accelerate time-to-market for common customer products. Partners within the IFS Acceleration Program EDA Alliance have early access to Intel‘s process and packaging technologies to jointly optimize and enhance tools and processes to take full advantage of Intel‘s technical capabilities.
As a member of the alliance, Siemens will work closely with IFS to provide optimized IC design tools, processes and methodologies for Intel‘s world-class processes. Siemens EDA products initially certified by IFS include the industry-leading Calibre nm platform and the Analog FastSPICE platform. Circuit verification function.
Joe Sawicki, executive vice president of Siemens Digital Industry Software IC-EDA, said, "Semiconductors are increasingly important to today‘s global economy, fueling the creation of advanced products. It is an honor to work with IFS to provide fine-tuned software solutions. Assist customers of both parties to make full use of Intel‘s process and packaging technology to achieve innovation.
Rahul Goyal, vice president and general manager of Intel‘s product design ecosystem support, pointed out that the IFS ecosystem alliance is a major step forward for Intel‘s chip foundry business vision. Through the combination of Siemens EDA products and IFS advanced process technology, Both parties will provide design teams in the industry with the solutions they need to gain an edge in today‘s competitive IC market.
ABOUT US
Company Profile
Company Culture
Company ISO certificate
PRODUCTS
SIEMENS
ABB
Fanuc
Schneider
MITSUBISHI
Texas Instruments
NXP
STMicroelectronics
OMRON
DELTA
NEWS
Company News
Industry News
CONTACT US
    Contact Person: Mr. Andy Luo
    Job Title: Sales
    Business Phone: +(86) 13632701337 (electronic component) , +(86)13632701337 (Automation Part )
    WHATSAPP: +86 13632701337 (electronic component) , +(86)13632701337 (Automation Part )
    Wechat: +86 13632701337 (electronic component) , +(86)13632701337 (Automation Part )
    Skype: happylowping
    ICQ: 458036258
    Email:andyluo@kinglionski.com  (electronic component) , andyluo@kinglionski.com  (Automation Part )