According to the latest report from Strategy Analytics, Infineon‘s revenue and market share in 2020 have successfully replaced NXP as the leading supplier of automotive semiconductors. Several leading companies (Infineon, NXP, Renesas, Texas Instruments and STMicroelectronics) conduct PKs in automotive electronics such as powertrain, body, safety and chassis services (PBCS). In the rise of new energy vehicles, the three powers (battery, electric drive, electronic control) and the four modernizations (electricalization, intelligence, networking, and digitalization) are developing rapidly.

As the dominant power device, silicon-based IGBT is used in the three subsystems of the electric control system, on-board air conditioning system, and charging pile inverter in the new energy vehicle, accounting for about 7%-10% of the cost of the whole vehicle. The component with the second highest cost is also the key component that determines the energy efficiency of the vehicle. This piece is mainly composed of the two giants of Infineon and Mitsubishi Electric. Infineon‘s domestic market share in 2019 is 58.2% and the global market share is 35.6%.

For Instrument Cluster (Virtual And Hybrid Clusters, Head-Up Display), Driver information (Navigation, Central Info Display, Rear-Seat entertainment), Body & connectivity (HVAC, GateWay, Body Control, Comfort, Lighting), Chassis & safety, In terms of PowerTrain & xEV, ADAS (TPMS, Telematics, Srround Camera, Radar System), etc., Infineon has corresponding products to meet the needs, such as TVI-B, TVI-C, TC3X (TC33, TC36, TC37, TC38, TC39 , TC3E), etc., and have passed the relevant certification of AEC-Q100 and ISO26262.

Traveo II can provide different flash storage spaces, up to 4M, and can also provide different chip packaging methods, such as LQFP, TEQFP, BGA and other pin packages, provide eSHE and HSM solutions and underlying libraries, flexible space configuration, chip Using Cortex M0+ and M4/M7 architecture, up to dual M7 cores, it can support true FOTA, and provide a wealth of software, tools and development boards.

In terms of software, it can provide SDL sample library, AUTOSAR MCAL, Graphics driver graphics driver library, HSM security performance library, etc. In terms of tools, it supports IAR, GreenHills, Lauterbach, etc.

The low power consumption of the MCU is very good, and the interfaces are rich, such as TCPWM, ADC, CAN, LIN, ethernet, SCB, CXPI, etc., and it benchmarks Renesas RH850, NXP S32 and other products in automotive electronics.