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Design scheme of non-dead-angle disinfection touch interface for NXP products
Publish:IC chip, PCB, PCBA, integrated circuit and other electronic components-Shenzhen Hao Qi Core Technology Co., Ltd  Time:2022-02-06  Views:463
In the post-epidemic era, people pay more and more attention to the cleaning and disinfection of objects. Taking the contact-type operation interface as an example, the operation interface of most devices adopts the method of multi-curved buttons or membrane buttons. However, the multi-curved buttons are not easy to clean, and the membrane buttons require additional mold opening, which is costly and has a single button shape design.
Therefore, the design solution of the touch interface without dead angle disinfection is introduced. The Touch Pad is designed using the mutual inductance structure, and the Touch Pad can be measured through the MCU touch sensor interface TSI without additionally mounting the Touch Pad Driver IC. In the circuit board design, a circular plane or a polygonal plane can be used, which is easy to clean and sterilize, and it is easier to design according to the appearance of the product.
The MKL16Z64VFT4 MCU featured in this solution features an Arm Cortex-M0+ core with multiple flexible low-power modes, including a new compute mode that reduces dynamic power consumption by placing peripherals in an asynchronous stop state. In terms of functional design, this solution can be used for extended development and application with the gaming mouse and headset solutions developed by World Peace, so as to customize the Touch Pad function. Taking Headset as an example, the data scanned by Touch Pad can be transmitted to peripheral devices through I2C Port, so as to realize functions such as song play/stop, song switching, and volume adjustment.
Core technical advantages:
Provide relevant software and hardware design for rapid development by customers;
Mainstream small ultra-low power microcontroller QFN 48pin;
The sensing distance of the touch panel is 0~10mm;
Low-power hardware touch sensor interface TSI, measuring Touch Pad does not need to mount additional Touch Pad Driver IC, can enjoy both MCU and Touch Pad Driver IC functions to develop products.
Program Specifications:
Through 90nm TFS technology, the energy-saving architecture is optimized for low power consumption;
The power consumption in ultra-low power operation mode is less than 40μA/MHz;
With complete state retention and 4.5μs wake-up function, the static power consumption is less than 2A;
Cortex-M0+ processor running at up to 48MHz;
Memory options 128KB Flash and 16KB RAM;
Nine low-power modes can be switched to improve MCU performance or reduce power consumption according to the application;
4-channel DMA controller, supports up to 63 request sources;
Low power hardware touch sensor interface (TSI);
QFN32 (5x5mm), QFN48 (7x7mm), LQFP (10x10mm).
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